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IC Package/System Design Engineer

Company: Qualcomm
Location: San Diego
Posted on: September 16, 2020

Job Description:

Company:Qualcomm Technologies, Inc.Job Area:Engineering Group, Engineering Group > ASICS EngineeringJob Overview:Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in.The IC Package Architecture and Design Team at Qualcomm has an opening for Package/System Design Engineer. This team is responsible for road mapping, architecting, design methodology, design implementation and verification for all Qualcomm package products (Digital, RF, Analog, PMIC, etc...).Job responsibilities for this position include package selection, package design, and package EE modeling. This involves optimizing system co-design of IC-PKG-PCB die keeping in mind package footprint/height constraints, IC floor-planning , PCB ,high-speed signal integrity , power distribution network and thermal constraints. Additional responsibilities:IC top level floorplanning including hard macro block placement, padring, RDL and bump pattern/assignment * System levelco-design methodology of IC, Package and PCB/BoardConcept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level costPackage design flow methodologyimplementing high speed interface SI constraints for jitter, IR drop, cross-talk, and SSN specsPackage design flow methodology implementing power distribution network (PDN) constraints for high speed processor cores (1GHz+) including design optimizationtechniques at the die/pkg/PCB levelsWorking with marketing/IC/product teams on competitive analysis and road mapping package technology for future productsMinimum QualificationsBachelor's degree in Engineering, Information Systems, Computer Science, or related field.2+ years Hardware Engineering experience or related work experience.Preferred QualificationsExperience in IC package and/or PCB selection , design , and layout experienceExperience in Pinmap optimization of optimal PCB designExperience with DDR3/DDR4 layout processExperience or knowledge in PCB design process like Schematic captureExperience in IO + PKG + PCB SI/PI modeling, co-simulation and analysisStrong knowledge in 3D/2D EM simulation tool, electromagnetic theory and transmission line theoryWorking knowledge of die floor planning, IO placement, andbump placement - Working knowledge of Chip, Package and PCB co-design methodologyFamiliar with assembly and substrate manufacturing processFamiliar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements.Familiar with PCB stack-up and breakout strategyApplicants: If you are an individual with a disability and need an accommodation during the application/hiring process, please call Qualcomm's toll-free number found here for assistance. Qualcomm will provide reasonable accommodations, upon request, to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. Qualcomm is an equal opportunity employer and supports workforce diversity.To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Keywords: Qualcomm, San Diego , IC Package/System Design Engineer, Other , San Diego, California

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